1. Process control. Based on product failure analysis, requirements for product quality objectives, process control, establishment of product quality objectives, process control methods, and quality evaluation method system. Covering multiple dimensions, process fluctuations, product incoming materials, equipment capabilities, chemical fluctuations, and manufacturing operations.

2. Introduction of new products. Undertake the process development of new product introduction, leading the process from research and development, small batch, medium batch, to production conversion. Resolve the issues that need to be addressed during each stage of import, delivery conditions, and process control documents.

3. Procurement of new equipment. Translate product requirements into process and equipment requirements, draft technical requirements for new equipment, select and validate them for import.

4. Process cost reduction. Introduce cutting-edge industry processes and design low-cost process solutions.

1. More than 5 years of experience in semiconductor yellow light process;

2. Bachelor's degree or above, with a background in engineering, preferably in materials science or chemistry;

3. Familiar with the 16949 system concept and tools;

4. Design and improve process capability based on first principles;

5. Possess excellent logical thinking ability, technical research spirit and ability;

6. Good execution ability, communication and expression skills, adaptability and problem-solving ability, result oriented and self-motivated.

1. Equipment development. Based on product quality objectives, process control objectives, and manufacturing efficiency objectives, design equipment to meet the product window from equipment design, integrate product process control into equipment design, and deploy equipment information integration capabilities in advance.

2. Equipment management. Based on product failure and equipment failure, process control is carried out on equipment hardware, software, and vulnerable and consumable parts to achieve the goal of early prevention of failure and predictable equipment capabilities.

3. Equipment upgrade. Based on product iteration, cost targets, and cutting-edge designs from other industries, introduce solutions to enhance product competitiveness.

4. Team building. Complete device development and build the device maintenance team from scratch. Support the improvement of the company's factory organization.

5. New employee development. Having a long-term development perspective, selecting and cultivating high potential talents. Support the implementation of the company's long-term talent strategy.

1. Bachelor's degree or above, with a background in engineering, preferably in materials science, mechanical automation, or microelectronics;

2. More than 8 years of experience in semiconductor equipment team management;

3. Have experience in supporting mass production and can develop parameters according to different requirements;
4. Excellent execution, adaptability, and problem-solving skills, results oriented, and self driven.

1. Responsible for the development and mass production of copper/nickel gold electroplating processes for electronic ceramic devices;

2. Responsible for the selection, debugging, acceptance, daily operation, and maintenance of electroplating production equipment;

3. Responsible for analyzing and locating process issues during the mass production stage of the product, solving and closed-loop management, and preventing recurrence;

4. Responsible for iterative optimization of the process in terms of performance, yield, cost, efficiency, etc;

5. Responsible for drafting electroplating process specifications, SOPs, related control documents, and training operators.

1. Bachelor's degree or above, majoring in chemistry, chemical engineering, materials science or related fields;

2. Proficient in electroplating technology, including monitoring plating solution concentration and adjusting process parameters, mastering the functions and mechanisms of electroplating solution components;

3. Experience in laser heat sink and LED heat sink electroplating is preferred, and experience in nickel gold electroplating for electronic products is preferred;

4. Possess excellent logical thinking ability, technical research spirit and innovation ability, execution ability, adaptability and problem-solving ability, result oriented and self driven.

1. As the process manager for heat sink product slicing, laser marking, and box entry areas, responsible for developing process parameters and optimizing standard operating procedures;

2. Responsible for the selection, installation, debugging, acceptance, and maintenance of relevant equipment;

3. Develop and update defect standards according to customer requirements, and establish abnormal OCAP processes;

4. Responsible for iterative optimization of the process in terms of performance, yield, cost, efficiency, etc;

5. Timely handle production line abnormalities, analyze and locate the root cause of problems, thoroughly solve them, and prevent recurrence.

1. Bachelor's degree or above, with a background in engineering, preferably in materials science, mechanical automation, or microelectronics;

2. More than five years of experience in semiconductor post-processing, familiar with wafer cutting/cutting (Saw, Laser Groove), laser marking/back printing (Laser Marking), chip pick&place and other processes, familiar with mainstream equipment;

3. Have experience in supporting mass production and can develop parameters according to different requirements;

4. Familiar with the development and maintenance of process related documents, proficient in using tools such as PDCA, 8D, FMEA, etc., and have good reporting abilities;

5. Have project management experience, able to independently complete continuous improvement projects, improve yield or reduce costs;

6. Possess excellent logical thinking ability, technical research spirit and ability;

7. Excellent execution, adaptability, and problem-solving skills, results oriented, and self driven.

1. Responsible for internal and external feedback and improvement work of suppliers; Participate in the initiation of new suppliers and the evaluation of potential suppliers; Participate in QSTC supplier evaluation work;

2. Promote the construction of supplier system, process audit and various training work;

3. Develop improvement work based on internal and external feedback indicators, handle on-site quality issues, handle and review problems;

4. Coordinate various functional departments to promote quality improvement of purchased parts;

5. Carry out quality improvement projects based on the quality status of purchased parts; Responsible for promoting various projects related to supplier quality management that have been decomposed into departments;

6. Conduct product quality, quality management system, and system reliability design, research, and control;

7. Organize and implement quality supervision and inspection, testing, analysis, identification, consulting and other work;

8. Understand the qualification assessment management of product certification, production license certification, system certification, auditor and reviewer registration, quality inspection agency and laboratory assessment, etc;

9. Research and develop testing techniques, testing methods, testing instruments and equipment;

10. Develop quality and technical regulations and supervise their implementation;

11. Design, implement, improve, and evaluate quality and reliability information systems.

1. Bachelor's degree or above, major in science or engineering related fields;

2. More than 3 years of work experience, with a background in quality management, procurement management, and production management knowledge; Understand the relevant laws and regulations on labor, quality, metrology, safety and environment in the country; Familiar with basic knowledge of quality management and cost management;

3. Proficient in using office software such as Word and Excel;

4. Experience in semiconductor packaging engineering and automotive industry quality workers is preferred.

1. Participate in the formulation of coating (magnetron sputtering) process routes and standards for electronic ceramic products, process development, and mass production introduction;

2. Responsible for the selection, debugging, acceptance, mass production introduction, and daily maintenance management of coating equipment;

3. Responsible for analyzing and locating process and equipment issues during the mass production stage of the product, resolving and implementing closed-loop management, and preventing recurrence;

4. Responsible for iterative optimization of the process in terms of performance, yield, production capacity, cost, efficiency, etc;

5. Responsible for drafting process specifications, SOPs, relevant control documents, and providing training and guidance for operators.

1. Bachelor's degree or above, with a background in engineering, preferably in materials science or physics, and more than 8 years of relevant work experience;

2. Possess excellent logical thinking ability, technical research spirit and ability;

3. Good execution ability, communication and expression skills, adaptability and problem-solving ability, result oriented and self-motivated.

1. Responsible for the research and optimization of gold and tin deposition technology, improving product yield and reducing costs;

2. Track the production process of new product development and vapor deposition technology, responsible for data collection, organization, statistics, and analysis;

3. Coordinate with process personnel to improve the process and ensure that the new product meets expectations;

4. Communicate with other technical departments, follow up on the development of new technologies and the company's new technology layout plan.

1. Bachelor's degree or above, with a preference for majors in microelectronics, physics, microwave communication, or related fields;

2. 5 years or more of experience in metal deposition technology in the semiconductor industry;

3. Have a deep understanding of vapor deposition technology, be familiar with process improvement and equipment structure and principles, and proficiently operate and maintain vapor deposition machines;

4. Strong research and development learning ability, possessing good logical thinking and communication coordination skills;

5. Willing to endure hardship and have a sense of responsibility.

High potential storage: Assistant General Manager, Assistant Product Manager, Assistant Factory Manager, Assistant Single point Process Manager.

1. 211 degree or above, with priority given to science and engineering majors;

2. Age around 24-28 years old;

3. Self driven with passion and strong ability to withstand pressure;

4. Outgoing personality, strong language expression ability, good at communicating with others;

5. Having leadership skills and clear career planning.

Note: Not a bookworm, strong logical thinking ability.